Laser Fired Contacts For cSi Solar Cells
On the back side of the crystalline wafer there are thin dielectric layer covered with aluminum layer. It is possible to have omic contact on the back side of the cell while aluminum is being fired with laser pulses and penetrates thru dielectric layer to the silicon. For this application nanosecond lasers are used mostly.
Galvanometer scanners are used to control laser beam on the working field. Machine vision feature enables to detect wafer position and do the job precisely. Flexible and reliable software named “SCA” helps to control the process with scientific and industrial modes.
