A cost effective optical unit dedicated for wafer processing in laboratory environment. Very small footprint allows easy installation in existing laboratory facilities, by attaching it to an optical table. Integrated high-performance galvanometer scanners are able to process both – 5″ and 6″ wafers. Customized release of SCA student controls XY or XYZ beam scanning and laser parameters.
Advantages:
- Reliable operation
- Non-contact processing
- Very small footprint and compact size
- Convenient automation software
- Cost effective solution
- Convenient sample tilting
- Vacuum chuck and dust removal options
- Machine vision option
Workshop of Photonics also provides laboratory testing of particular wafers for development of laser processes.
Possible applications include:
- Solar cell laser processing
- Semiconductor wafer processing
- Metal sheet cutting and marking
- Transparent material processing (with femtosecond lasers)
The scanning unit incorporates:
- High performance gavanometer scanners
- Machine vision for precise wafer edge detection (on request)
- Beam expander for high power applications and effective use of clearance apperture (on request)
- Automated Z scanning unit (on request)
- Dedicated software for specific process
- Mechanical tilting assembly
- Control electronics
WOP- XS is a laser scanning solution for laboratories. Based on customers requirements, suitable laser source is selected and adjusted. Process development is possible in industrial WOP’s and associate laboratories, therefore customers might entrust all laser related questions to us. Our experience includes nanosecond, picosecond and femtosecond laser processing as well as machine vision solutions and integration.
Possible applications include:
- Laser Marking
- Edge Isolation
- Back Contact Laser Firing (BCLF )
- Wafer Dicing
- Laser Cutting
Product is engineered and assembled in Lithuania (European Union).
Keywords: laser scanning, solar cells, laser source, photovoltaics, PV, laser marking, laser dicing, edge isolation, back contact formation, laser cutting.

