Laser Micro Drilling

Glass Drilling     Sapphire Drilling     Silicon Drilling     Ceramics Drilling     Optical Fibers Drilling     Metal Drilling      Polymer Drilling

Laser micro drilling ensures high drilling speed, good surface quality, and a wide range of hole diameters. The holes are drilled with a controlled taper in various materials – even hard and fragile.

Features

  • Taper control
  • Good bottom and sidewall quality of drilled wells
  • Variable geometry of holes
  • High-speed laser processing
  • No melting and micro-cracks in peripheries
  • A broad range of available parameters to suit every material
  • Smooth drilled hole side wall and bottom finish
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Glass Drilling

Laser drilling of glass using femtosecond laser radiation is a state-of-the-art technique showing many advantages over conventional laser processing, mechanical drilling, or lithography. We use conventional laser drilling techniques, as well as unique Workshop of Photonics developed methods to achieve the highest quality in the market.

Advantages – lower costs, minimal surface finish needed, and ultra-high accuracy.

Features:

  • No melting and micro-cracks in peripheries
  • Aspect ratio up to 1:100
  • Possibility for very densely packed hole arrays
  • Zero taper
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Sapphire Drilling

Laser drilling of sapphire using femtosecond laser radiation is a unique processing technique enabling no cracks in hole peripheries, accurate taper control, and smooth wall finish. Workshop of Photonics continues the development of sapphire drilling techniques to meet our customers’ needs.

Advantages –ultra-high accuracy, reliable process control, minimal or no post-processing is needed.

Features:

  • No melting and micro-cracks in peripheries
  • Accurate taper control
  • Smooth inner surfaces finish
  • Minimized stress area around drilled holes

Different processing parameters might be developed upon request.

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Silicon Drilling

Silicon processing methods, applying our unique femtosecond laser capabilities, enable us to offer market-leading services.

Silicon is the most widely used material in numerous fields – semiconductors, electronic devices, computer chips, solar cells, diverse alloys, etc.

Features

  • Ultra-high precision
  • No cracking of the material
  • Accurate taper control – positive, negative, or zero taper
  • High aspect ratio
  • Possibility of drilling blind and through holes
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Ceramics Drilling

Ceramics, due to its unique available properties, is a leading material in communications and has been a top choice among many of our customers.

Applying our unique femtosecond laser capabilities for ceramic drilling, we employed our processing methods in order to offer market-leading services.

We are confident in offering hole diameters from a few micrometers to tens of millimeters at a very competitive price.

Features

  • No cracking of the material
  • Accurate taper control – positive, negative, or zero taper
  • High aspect ratio
  • Possibility of drilling blind and through holes
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Optical Fibers Drilling

Laser drilling of optical fibers using femtosecond laser radiation is a state-of-the-art technique showing many advantages over conventional laser processing, and mechanical drilling that enable precise process control.

Advantages – high processing speed, lower costs, and higher accuracy.

Features:

  • No melting and micro-cracks in peripheries
  • Hole diameter as small as 10 μm
  • Precise control of taper angle and depth
  • Variable geometry of holes

Different processing parameters might be developed upon request.

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Metal Drilling

Laser drilling of metal alloys brings high quality and precision for many applications – diverse filters, mesh filters, FCO melt filtration, aerosol generation, inhalation applications, drug delivery systems, functional surfaces, fuel delivery systems, and many more.

Advantages – processing speed, high accuracy, and surface finish.

Features:

  • No melting and thermal impact in peripheries
  • Holes diameter from micrometer range micrometer to centimeter range
  • Precise control of taper angle
  • Variable geometry of holes
  • Different processing parameters might be developed upon request.
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Polymer Micro Drilling

The Femtosecond lasers we use for polymers micromachining – polymer micro cutting and drilling – are unique due to minimized heat effects while keeping sub-micron feature size, providing superior quality and precision. It is a perfect choice when other lasers or mechanical polymer processing methods do not meet technical and quality requirements.

We work with thermoplastic polyesters, like polyethylene terephthalate (PET) and polybutylene terephthalate (PBT). Also, BICOR films, cyclo olefin copolymer (COC), diverse polyester films, and foils.

Features:

  • Polymers thickness from 8 to 250 µm
  • Straight and circular cut trajectories
  • Hole tolerance ~2 µm
  • Minimal or no discoloration
  • Minimal or no signs of heat-affected deformations
  • Excellent cut surface quality, sub-micron precision of shape
  • High-speed laser processing
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Contact
information

WORKSHOP OF PHOTONICS
Mokslininku st. 6A, Vilnius, LT-08412, Lithuania

Phone: +370 5 215 7551
E-mail: [email protected]

Company details

Altechna R&D, UAB
Company code 301502628
VAT code LT100006155012
Bank – SEB 70440
LT87 7044 0600 0770 8092