Femtosecond Laser Micromachining Workstation FemtoFAB

Femtosecond laser micromachining system FemtoFAB is a turnkey laser machine designed for specific industrial process. Configuration is selected and carefully tuned according to a specific laser micromachining application. System is protected by Class 1 equivalent laser safety enclosure and controlled through advanced SCA engineer software window.

  • Ceramics scribing
  • Glass cutting
  • Sapphire cutting
  • Laser drilling
  • Solar cell manufacturing
  • Birefringent pattern fabrication
  • other applications on request

Femtosecond laser based micromachining workstation FemtoFAB provides high speed and precision required for many different industrial laser micromachining applications.

Femtosecond laser micromachining workstation FemtoFAB features:
  • High fabrication speed – up to 300 mm/s (more on request)
  • Fabrication of complex objects with submicron resolution
  • Minimal heat affected zone
  • Precise object positioning with submicron accuracy
  • High-performance galvanometer scanners
  • Pulse density control
  • Synchronization of laser pulses with moving object in space and time domains
  • Original software interface for control of all integrated hardware devices
High speed

Highly reliable industrial grade femtosecond laser micromachining workstation synchronized with linear positioning stages and galvanometer scanners offers significant advantages in high speed melt-less micromachining.

Nanometer resolution

High resolution object positioning system synchronized with laser beam positioning system (galvanometer scanners) and laser pulse picker gives full control in space, time and energy domains, allowing to fabricate difficult objects with submicron resolution.

Technical specifications for a femtosecond laser based micromachining workstation for industrial use FemtoFAB are defined by the task, for which workstation is optimized. It may vary in the range, similar to FemtoLAB.

Parameter Value 
Pulse duration 200 fs – 10 ps
Repetition rate 1 kHz – 1 MHz
Average power Up to 20W
Pulse energy Up to 2 mJ
Wavelength 1030 nm, 515 nm, 343 nm, 258 nm, 206 nm
Positioning accuracy ± 250 nm
Travel range From 25×25 mm to 300×300 mm (larger on request)
Principle configuration:
  • Laser source
  • Sample positioning system
  • Beam delivery and scanning unit
  • Laser power and polarization control
  • Software for system control (autofocusing and mashine vision on request)
  • Sample holders and special mechanics (sample handling automation on request)
  • Optical table
  • Enclosure (full or partial)
  • Dust removal unit

Laser system is automated with micromachining software SCA. This software is essential part of laser system and is not sold separately.

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